computing chips in AV

chips requirements in vehicle

Bosch :
Bosch

BMW:
BMW

the next-generation vehicle EE platform can be easily modulized based on the topology of network composed by domain controllers and in-vehicle Ethernets. take an example with Singulato iS6, which has five domains: smart driving, powertrain, chassis, smart body, smart seat.

each domain need support by a domain controller unit(DCU), the core of which is a powerful computing chip, which is usually more powerful than traditional ECUs. in average, L2 requires computing power about 10TOPS , L3 needs 60TOPS, L4 needs 100TOPS.

computing chips

product MDC600 Driver PX Pegasus EyeQ 4 BlueBox R-car H3 Journey2.0
Huawei Nvidia Mobileye NXP Renesas Horizon
TOPS 352 320 2.5 10
main cores 8 * 晟腾310 16 ARM VMP LS2084A 4*Arm/A57 BPU2.0
other cores Ascend 310 2 TensorCore GPU S32V234 4*Arm/A53 FPGA
AV-level L3+ L5 L3 L4(target) IVI L3
Camera support 16 10 8 8 8 4
Lidar support 8 6
function safety ASIL-D ASIL-B ASIL-D ASIL-D(target) ASIL-B ASIL-B

R-car H3

products timeline

Tier1s/Tier2s timeline

2018 2019 2020 2021
Aptive level3 level4
Bosch level2 level3 level4
Conti level2 level3+
Autoliv level2 level3 level4
Intel level3 level4+
Nvidia level3 level4+

Chinese OEMs timeline

2019 2020 2021 2022+
changan level4
FAW level4
GAC level3 level5
Geely level3 level5
GWM level3 level4
SAIC level3
xiaoPeng level3
WeiMa level3
Nio level2 level4+

global OEMs timeline

2018 2019 2020 2021 2022+
Ford level2 level4
GM level2 level4
Fiat-Crysler level3+
Audi level2 level4
Mercedze level2 level3 level4
Toyota level2 level3 level4
Honda level3 level4

reference

Matrix 1.0

the five chip vendors

from GPU to ASIC

hauwei and the others

global chips vendors

L4 AI chips

the evolution of EyeQ

Mobileye tech

NXP bluebox

R-car H3 soc

NXP function safety

horizontal AI matrix2.0

cars, mobility, chip-to-city design and the Iphone4

2018-2019 汽车域控制器产业研究报告

汽车电子演化

Global L3 self-driving vehicle market insights 2019

self-driving car research report